The HybridPACKTM Drive G2 modules from Infineon Technologies are now available for purchase from Mouser Electronics, Inc., the top New Product Introduction (NPI) distributor in the industry with the largest assortment of semiconductors and electronic componentsTM. By improving upon the HybridPACK Drive G1 modules, the G2 modules offer a better power density while keeping the same small module size. Effective automobile power modules for traction inverters in electric and hybrid vehicles (HEVs) are the HybridPACK Drive G2 Modules.
For scalable performance, Infineon’s next-generation EDT3 (Si IGBT) and CoolSiCTM G2 MOSFET chip technologies are integrated into the Infineon HybridPACK Drive G2 modules, which are now offered by Mouser. The user-friendly power modules have a number of cutting-edge capabilities, such as on-chip temperature measurement and sensor integration possibilities, that allow for system cost savings. For improved performance and longer product life, the HybridPACK Drive G2 modules also come with a number of package improvements. Direct cooling is made possible by a PinFin baseplate, and enhanced pin rivets provide durability across the whole temperature range.
Up to 300 kW of power can be delivered by the HybridPACK Drive G2 modules in the 750V and 1200V classes. The HybridPACK G2 modules are perfect for severe situations because of their excellent durability and enhanced thermal conductivity. Comparing the HybridPACK Drive G2 SiC to the most advanced IGBT solutions, the former decreases inverters losses by two-thirds while offering higher gate oxide and cosmic ray reliability.
