Infineon Technologies has announced the release of its first silicon carbide (SiC) products based on advanced 200mm wafer technology. Manufactured in Villach, Austria, these products are designed for high-voltage applications, including renewable energy systems, trains, and electric vehicles.
The transition of Infineon’s manufacturing site in Kulim, Malaysia, from 150mm wafers to the larger and more efficient 200mm-diameter wafers is fully on track. The newly built Module 3 is poised to commence high-volume production aligned with market demand.
Dr. Rutger Wijburg, Chief Operations Officer of Infineon, stated, “The implementation of our SiC production is progressing as planned, and we are proud of the first product releases to customers.” He further emphasized that ramping up SiC production in Villach and Kulim in phases is improving cost-efficiency and ensuring product quality.
Infineon’s SiC products enable customers to develop energy-efficient solutions for electric vehicles, fast-charging stations, trains, renewable energy systems, and AI data centers. The release of these products marks a substantial step forward in Infineon’s SiC roadmap, focusing on providing a comprehensive portfolio of high-performance power semiconductors that promote green energy and contribute to CO₂ reduction.
As part of the “Infineon One Virtual Fab” for wide-bandgap (WBG) technologies, Infineon’s production sites in Villach and Kulim share technologies and processes that allow for fast ramping and efficient operation in SiC and gallium nitride (GaN) manufacturing.
